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Train Intelligent Computing Board Modular Architecture Event Recorder
| Place of Origin | China |
|---|---|
| Brand Name | HTR |
| Minimum Order Quantity | 100pcs |
| Price | negotiable |
| Packaging Details | Carton box, Wooden case, as per requires |
| Delivery Time | 15-50 days, depends on QTY |
| Payment Terms | L/C,T/T,Western Union,Paypal |
| Supply Ability | 1,000 pcs/month |
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xProduct Details
| Memory | 1-16GB Optional | Power Supply | 110 Vd±30% |
|---|---|---|---|
| Power Consumption | Max 30W | Serial Port | RS485 |
| Maintenance Interface | USB, Ethernet | Storage Capacity | 8-128GB |
| Storage Temperature | -40°c To+85°c | ||
| Highlight | Modular Architecture Intelligent Computing Board,Train Intelligent Computing Board,Event Recorder Intelligent Computing Board |
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Product Description
Train Intelligent Computing Board Modular Architecture Event Recorder
Product Overview
The HengtaiRail Railway Event Recorder features advanced event recording functionality designed for high-speed rail, urban rail transit, and locomotive applications. The system utilizes a modular architecture available in compact sizes up to standard 19-inch frame configurations.
Key Specifications
| Attribute | Value |
|---|---|
| Memory | 1-16GB Optional |
| Power Supply | 110 Vd±30% |
| Power Consumption | Max 30W |
| Serial Port | RS485 |
| Maintenance Interface | USB, Ethernet |
| Storage Capacity | 8-128GB |
| Storage Temperature | -40°C to +85°C |
Advanced Platform Features
- Modular master-slave chassis structure for flexible configuration
- High-performance intelligent computing board with scalable processing power
- Integrated vehicle-to-ground wireless transmission (4G/5G/WIFI) with BD/GPS dual-mode positioning
- Supports multiple field buses including MVB, TRDP, CAN, Ethernet, RS485/422/232
- Comprehensive configuration management and analysis software suite
- Protection module compliant with IEEE1482.1-2013 and IEC62625-2013 standards
- Adjustable main unit configuration adaptable to various vehicle types
Technical Specifications
| Component | Parameters |
|---|---|
| CPU | ARM Series, X86 Series, Domestic Rockchip, Loongson Series Optional |
| Vehicle Bus Interface | 2XMVB(EMD), 2XTRDP, 2XCAN |
| WiFi | Supports 802.11b/g/n RF(2.412GHz~2.472GHz) Wireless Protocol |
| 4G/5G | Supports Max Downlink Rate 150Mbps and Max Uplink Rate 50Mbps |
| I/O | Digital Input: High Level +12 to 154VDC Frequency Input: Rectangular, Max f 10kHz Analog Input: 0 to 10V or 4 to 20mA Analog Output: 0 to 10V or 4 to 20mA Transistor Output: Open Collector Relay: Switching Contact |
| Operating Temperature | -40°C to +70°C (Heating function starts below -30°C), Short-term (10 min) up to 85°C |
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